Name: Tessa Chambers & Nick Osetek Date: 3/15/2018
Room Temperature: 70*F Humidity, etc: Dry
Experiment Goal: To become familiar with etch times in the saline sulphate bath (1-6 minutes increments) through varied line work.
Plate Material: Aluminum (5052)
Plate Preparation (surface prep, ground application, image making process, etc): The plate was beveled, degreased with Bon Ami, then coated in BIG hard-ground and baked at 220*F for about 20 minutes. The plate was then backed, and small 1-6 minute sections were drawn in on the plate to monitor etch times for each section. The plate rested for 1 week before etching.
Evaluation of Plate Preparation: Aluminum plate took much more time to degrease compared to copper. A layer or two more of BIG hard-ground could have been added to the plates to ensure thickness.
Etching Bath notes: 140g copper sulphate, 140g salt, 2 liters of warm water. This was the second use of the bath.
Time in Bath: 1 minute intervals, until 6 minutes.
After Bath Evaluation: The BIG ground was deteriorating off some of the corners of the plate (most likely due to grease.) Bath was cloudier, and build up of copper residue was floating around in the bath.
Removal of Grounds (chemicals used and evaluation of effectiveness): Soy Solv II was used to remove the BIG hard-ground. We let the Soy Solv II sit on the surface of the plate, then wiped it down with a cloth.
Inking Methods: Hanco Bone Black oil based etching Ink, 10% Burnt Plate Oil 00, wipe plate normally
Paper Type: Hahnemuhle Copperplate
Soaking Time: 15-20 minutes
Press, blanket set up and pressure: Praga press, 2 blankets, Right setting: 4/9 Left setting:5/9
Conclusion: Two of the upper corners of the print were a little spotty due to grease. The line work came out relatively well and the textures showed up clearly.