Name: Tessa Chambers & Nick Osetek Date: 3/15/2018
Room Temperature: 70*F Humidity: Dry
Experiment Goal: Become familiar with the current Zea Mays copper sulfate saline etch process and etch times by using an aluminum test plate marked w/ various line work and broken down into 1-6 minute segments.
Plate Material: Aluminum (5052)
Plate Preparation (surface prep, ground application, image making process, etc.): Prepared eight (8) 3″ x 3″ aluminum plates. Beveled plates, de-greased with Bon-Ami, applied BIG hard-ground and baked at 220*F for approximately 20 minutes, backed and marked the first plate with sequential etching sections from 1-6 minutes with a pen.
Evaluation of Plate Preparation: The aluminum plates took a lot longer to degrease than copper usually does. Plates could use a thicker application of hard-ground and need more time to cure before etching.
Etching Bath Notes: Plastic tub, 140g copper sulfate, 140g salt and 2 liters H20
Time in Bath: 1 minute etch intervals up to 6 minutes.
After Bath Evaluation: Plate overall held up well and retained line quality in etched areas, but small speckles of hard-ground started to lift in non-etched areas of the plate around at the 1-2 minute mark and 3-4 minute mark. Speckles appeared around the top corners and top edge of the plate. Hard-ground came off in speckles easily when wiping/drying the plate with a rag.
Removal of Grounds (Chemicals used and evaluation of effectiveness): Plate coated with Soy Solv II and wiped off with a rag to strip the hard-ground.
Inking Methods (Type of ink used, modifier, wiping/rolling techniques): No inking/printing involved
Paper Type: N/A
Soaking Time: N/A
Press, Blanket Set Up and Pressure: N/A
Possible issues: 1) Plate not de-greased fully. 2) Hard-ground not applied evenly or thick enough. 3) Copper residue sticking and not floating off of plate 4) BIG ground not cured long enough (no rest period after baking).